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A23W8308 preliminary 262,144 x 8 bit cmos mask rom preliminary (november, 1999, version 0.0) amic technology, inc. document title 262,144 x 8 bit cmos mask rom revision history rev. no. history issue date remark 0.0 initial issue november 11, 1999 preliminary
A23W8308 preliminary 262,144 x 8 bit cmos mask rom preliminary (november, 1999, version 0.0) 1 amic technology, inc. features n 262,144 x 8 bit organization n wide power supply range : +2.7v to +5.5v n access time: 120 ns (max.)/5v n 150 ns (max.)/3v n current: operating: 50ma (max.)/5v 15ma (max.)/3v standby: 50 m a (max.)/5v 25 m a (max.)/3v n mask programmed for chip enable (power-down) ce/ ce , output enable oe/ oe /nc n three-state outputs for wired-or expansion n full static operation n all inputs and outputs are directl y ttl-compatible n available in 32-pin dip, 32-pin sop, 32-pin plcc packages or in dice form. general description the A23W8308 high-performance read only memory is configured as 262,144 x 8 bits. it is designed to be compatible with all microprocessors and similar applications where high-performance, large-bit storage, and simple interfacing are important design considerations. this device is designed for use with operating voltage from 3v to 5v. the A23W8308 offers an automatic power-down controlled by the chip enable ce/ ce input. when ce/ ce goes low/high, the device will automatically power-down and remain in a low power standby mode as long as ce/ ce remains low/high. A23W8308 also offers oe/ oe /nc (active high or low or no connection), which eliminates bus contention in multiple bus microprocessor systems. pin configurations n n p-dip / sop n n plcc A23W8308 a6 a10 a9 o 6 nc a16 a15 a12 a7 a6 a5 a4 a3 a2 o 0 o 1 o 3 o 4 o 5 a11 a9 a13 vcc a10 A23W8308 1 2 3 4 5 6 7 8 9 10 11 12 13 14 19 20 21 22 23 24 25 26 27 28 29 30 31 32 a8 o 2 gnd o 6 o 7 ce/ce a14 a5 a4 a3 a2 a1 a0 o 0 o 7 a8 a13 a14 a12 a15 a16 nc vcc nc a17 o 1 o 2 gnd o 3 o 4 o 5 1 2 3 4 5 6 7 8 9 10 11 12 13 32 31 30 14 16 15 17 18 19 20 21 22 23 24 25 26 27 28 29 oe/oe/nc 18 15 16 17 a1 a0 nc a17 ce/ce a11 a7 oe/oe/nc
A23W8308 preliminary (november, 1999, version 0.0) 2 amic technology, inc. block diagram column selector circuitry row decoder driver memory cell array 262,144 column decoder driver power-down or output enable circuitry a0 - a17 address inputs o6 o5 o4 o3 o2 o1 o0 ce/ce oe/oe/nc o7
A23W8308 preliminary (november, 1999, version 0.0) 3 amic technology, inc. pin descriptions pin no. 32l dip/sop 32l plcc symbol description 2 - 12, 23, 25 - 30 2 - 12, 23, 25 - 30 a0 - a17 address inputs 22 22 ce/ ce chip enable input (note 1) 24 24 oe/ oe /nc output enable (note 1) 13 - 15, 17 - 21 13 - 15, 17 - 21 o0 - o7 data outputs 32 32 vcc power supply 16 16 gnd ground 1, 31 1, 31 nc no connection (note 2) notes: 1. this pin is user-definable as active high or active low. 2. nc indicates "no connection." recommended dc operating conditions (t a = 0 c to + 70 c) symbol parameter min. max. unit vcc supply voltage 2.7 5.5 v gnd ground 0 0 v v ih input high voltage 0.7* vcc vcc+0.3 v v il input low voltage - 0.5 0.8 v
A23W8308 preliminary (november, 1999, version 0.0) 4 amic technology, inc. absolute maximum ratings* ambient operating temperature . . . . . . . -10 c to + 80 c storage temperature . . . . . . . . . . . . . . -65 c to + 150 c supply voltage to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to + 7.0v output voltage . . . . . . . . . . . . . . . . . -0.5v to vcc + 0.5v input voltage . . . . . . . . . . . . . . . . . . -0.5v to vcc + 0.5v power dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mw *comments stresses above those listed under "absolute maximum ratings" may cause permanent damage to this device. these are stress ratings only. functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. exposure to the absolute maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics (t a = 0 c to + 70 c, gnd = 0v) symbol parameter 5.0v 10% 3.0v 10% unit conditions note min. max. min. max. v oh output high voltage 2.4 2.15 v i oh = -1ma (5v) i oh = -0.4ma (3v) v ol output low voltage 0.4 0.4 v i ol = 3.2ma (5v) i ol = 1.6ma (3v) v lh input high voltage 2.2 vcc + 0.3 0.7 * vcc vcc+0.5 v v ll input low voltage -0.5 0.8 -0.5 0.6 v l li input leakage current +10 +5 m a vcc = max. v in = vcc to gnd l lo output leakage current +10 +5 m a vcc = max. v out = vcc to gnd 1 i cc operating supply current 50 15 ma t cyc = min. 2 i sb standby supply current (ttl) 1.5 0.5 ma ce = v ih , ce = v il i sb1 standby supply current (cmos) 50 25 m a ce = vcc - 0.2v, ce = 0.2v
A23W8308 preliminary (november, 1999, version 0.0) 5 amic technology, inc. capacitance symbol parameter min. max. unit test conditions note c i input capacitance 10 pf t a = 25 c 3 c o output capacitance 10 pf f = 1.0mhz ac characteristics (t a = 0 c to +70 c, gnd = 0v) symbol parameter 5.0v 10% 3.0v 10% unit note min. max. min. max. t cyc cycle time 120 150 ns t aa address access time 120 150 ns t ace chip enable access time 120 150 ns t aoe output enable access time 70 90 ns t oh output hold after address change 10 10 ns t lz output low z delay 10 10 ns 4, 6 t hz output high z delay* 30 70 ns 5, 6 * t hz is specified from either oe / oe or ce / ce going disabled, whichever occurs first. notes: 1. oe/ce = v il , oe / ce = v ih (output is unloaded) 2. v in = v ih /v il, but oe/ce = v ih , oe / ce = v il (output is unloaded) 3. this parameter is periodically sampled and is not 100% tested. all pins, except pins under test, are tied to ac ground. 4. output low impedance delay ( t lz ) is measured from ce or oe going active. 5. output high impedance delay ( t hz ) is measured from ce or oe going inactive. 6. this parameter is sampled and not 100% tested.
A23W8308 preliminary (november, 1999, version 0.0) 6 amic technology, inc. timing waveforms propagation delay from address (ce/ ce = active, oe/ oe = active) t aa valid valid t cyc t oh address inputs data out propagation delay from chip enable or output enable (address valid) t ace t hz valid data out t aoe chip enable output enable valid valid t lz t lz ac test conditions applied voltage 5.0v 10% 3.0v 10% input pulse levels 0.4v to 2.4v 0.4v to 2.4v input rise and fall time 10 ns 10 ns timing measurement reference level v ih = 2.2v v il = 0.8v v oh = 2.0v v ol = 08v v in = 1.5v v out = 1.5v output load 1 ttl gate and c l = 100pf
A23W8308 preliminary (november, 1999, version 0.0) 7 amic technology, inc. function table ce/ ce oe/ oe /nc o0 - o7 mode a a data out read i x hi - z power-down a i hi - z output disable 1. ce/ ce and oe/ oe /nc are mask programmable as either active low, active high, or no connection. 2. "a" means "active," "i" means "inactive," and "x" means "either." ordering information access time ( ns) part no. 5.0v 3.0v package A23W8308 120 150 32l dip A23W8308m 120 150 32l sop A23W8308l 120 150 32l plcc A23W8308h 120 150 dice form
A23W8308 preliminary (november, 1999, version 0.0) 8 amic technology, inc. pad configurations pad location coordinate (um) coordinate (um) pad no. pad name x y pad no. pad name x y 1 vcc -73.6 894.3 18 o3 138.7 -907.7 2 a16 -259.9 907.2 19 o4 261.7 -907.7 3 a15 -409.9 907.2 20 o5 413.2 -907.7 4 a12 -532.9 907.2 21 o6 536.2 -907.7 5 a7 -682.9 907.2 22 o7 687.7 -907.7 6 a6 -805.9 907.2 23 ce/ ce 810.7 -907.2 7 a5 -955.9 907.2 24 a10 960.7 -907.2 8 a4 -1078.9 907.2 25 oe/ oe /nc 1083.7 -907.2 9 a3 -1079.3 -907.2 26 a11 1083.3 907.2 10 a2 -956.3 -907.2 27 a9 960.3 907.2 11 a1 -806.3 -907.2 28 a8 810.3 907.2 12 a0 -683.3 -907.2 29 a13 687.3 907.2 13 o0 -529.3 -907.7 30 a14 537.3 907.2 14 o1 -406.3 -907.7 31 a17 414.3 907.2 15 o2 -254.8 -907.7 32 nc 264.3 907.2 16 gnd -131.8 -907.7 33 vcc 97.1 905.7 17 gnd -8.8 -905.7 9 10 11 12 13 14 15 16 18 19 20 21 22 23 24 17 25 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 33 a4 a7 a6 a5 a12 a15 a16 vcc vcc nc a17 a14 a13 a8 a9 a11 a2 o 0 a0 a1 o 1 o 2 gnd gnd o 3 o 4 o 5 o 6 o 7 ce/ce a10 oe/oe/nc a3 (0,0) x y
A23W8308 preliminary (november, 1999, version 0.0) 9 amic technology, inc. package information p-dip 32l outline dimensions unit: inches/mm 1 32 e a 2 a l e 1 e a d c q b 1 b a 1 base plane seating plane 16 17 e dimensions in inches dimensions in mm symbol min nom max min nom max a - - 0.210 - - 5.334 a 1 0.015 - - 0.381 - - a 2 0.149 0.154 0.159 3.785 3.912 4.039 b - 0.018 - - 0.457 - b 1 - 0.050 - - 1.270 - c - 0.010 - - 0.254 - d 1.645 1.650 1.655 41.783 41.91 42.037 e 0.537 0.542 0.547 13.64 13.767 13.894 e 1 0.590 0.600 0.610 14.986 15.240 15.494 e a 0.630 0.650 0.670 16.002 16.510 17.018 e - 0.100 - - 2.540 - l 0.120 0.130 0.140 3.048 3.302 3.556 q 0 - 15 0 - 15 notes: 1. the maximum value of dimension d includes end flash. 2. dimension e does not include resin fins.
A23W8308 preliminary (november, 1999, version 0.0) 10 amic technology, inc. package information sop (w.b.) 32l outline dimensions unit: inches/mm 1 e h e l l e c 16 see detail f detail f 17 32 a 1 a 2 a s d seating plane d y e b q dimensions in inches dimensions in mm symbol min nom max min nom max a - - 0.118 - - 3.00 a 1 0.004 - - 0.10 - - a 2 0.101 0.106 0.111 2.57 2.69 2.82 b 0.014 0.016 0.020 0.36 0.41 0.51 c 0.006 0.008 0.012 0.15 0.20 0.31 d - 0.805 0.817 - 20.45 20.75 e 0.440 0.445 0.450 11.18 11.30 11.43 e 0.044 0.050 0.056 1.12 1.27 1.42 h e 0.546 0.556 0.566 13.87 14.12 14.38 l 0.023 0.031 0.039 0.58 0.79 0.99 l e 0.047 0.055 0.063 1.19 1.40 1.60 s - - 0.036 - - 0.91 y - - 0.004 - - 0.10 q 0 - 10 0 - 10 notes: 1. the maximum val ue of dimension d includes end flash. 2. dimension e does not include resin fins. 3. dimension s includes end flash.
A23W8308 preliminary (november, 1999, version 0.0) 11 amic technology, inc. package information plcc 32l outline dimension unit: inches/mm a 1 a 2 a e d y h d d 13 g d b 1 b g e c 5 14 20 21 29 30 32 1 4 e h e l q dimensions in inches dimensions in mm symbol min nom max min nom max a - - 0.134 - - 3.40 a 1 0.0185 - - 0.47 - - a 2 0.105 0.110 0.115 2.67 2.80 2.93 b 1 0.026 0.028 0.032 0.66 0.71 0.81 b 0.016 0.018 0.021 0.41 0.46 0.54 c 0.008 0.010 0.014 0.20 0.254 0.35 d 0.547 0.550 0.553 13.89 13.97 14.05 e 0.447 0.450 0.453 11.35 11.43 11.51 e 0.044 0.050 0.056 1.12 1.27 1.42 g d 0.490 0.510 0.530 12.45 12.95 13.46 g e 0.390 0.410 0.430 9.91 10.41 10.92 h d 0.585 0.590 0.595 14.86 14.99 15.11 h e 0.485 0.490 0.495 12.32 12.45 12.57 l 0.075 0.090 0.095 1.91 2.29 2.41 y - - 0.003 - - 0.075 q 0 - 10 0 - 10 notes: 1. dimensions d and e do not include resin fins. 2. dimensions g d & g e are for pc board surface mount pad pitch design reference only.

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